Armstrong Fluid Technology has announced the launch of Design Envelope EVERCOOLTM, a new solution for rapid deployment in mission critical cooling applications. Design Envelope EVERCOOL is an automation platform for mission critical cooling systems. The EVERCOOL platform offers pre-engineered, feature-rich options that can be configured on-site. The platform meets the stringent requirements of the Uptime Institute for Tier III data centers, while avoiding the traditional requirements of extensive site programming and customization. EVERCOOL reduces site commissioning time by up to 30% and reduces overall energy consumption, coordinating cooling system operation to reduce energy costs by as much as 40%.